Springboard attending Wounds UK 2014
29 October 2014
The latest innovations in wound care will be on show at the Wounds UK Annual Conference in Harrogate, 10 – 12 November 2014.
Last year’s event had a several advanced technologies lurking between the traditional products. Diagnostics made an appearance, such as Woundchek’s protease test strip and a new partnership between Molnlycke Healthcare and Edinburgh University to identify infection risk. Perhaps we will see further steps towards patient-specific measurement of infection, performed rapidly at the point of case so that a personalised response can be delivered to that particular individual?
There was also a great deal of activity by the newly funded NHS Health Technology Co-operatives, who were stepping up the effort to evaluate the performance of new technologies. Peter Vowden, clinical director of the Wound Prevention and Treatment co-operative said he wanted to improve the abilities of companies to target the most important issues with their new inventions. Several exhibitors spoke of their interest in following the evaluation programme, and so this year, with several technologies having completed the process, we should learn which ones were considered to be most valuable.
It will also be interesting to see where the commercial direction is heading in future. KCI will have completed the first year following their merger with Systagenix, so perhaps there will be an indication of the direction the new combined company will be taking. And ConvaTec have announced they are seeking a buyer, so will no doubt be seeking to present those technologies which they feel will represent the most exciting opportunities for growth.
Keith Turner of Springboard will be attending the event. As a company which develops new wound care technology for clients, we are always interested to speak to people about where the opportunities lie and how the latest advances in technology can be embraced to create business growth. Please get in contact via the form below to arrange a meeting at the conference.